 Composite member and separating method therefor, bonded substrate stack and separating metod therefo
专利摘要:
PURPOSE: A separating method is provided to appropriately separate a composite member such as a bonded substrate stack at a separation layer such as a porous layer. CONSTITUTION: A bonded substrate stack formed by bonding first and second substrates is appropriately separated. A first substrate(10) having a porous layer inside and a single-crystal Si layer and insulating layer on the porous layer is brought into tight contact with a second substrate while shifting their central positions to prepare a bonded substrate stack(30) having a projecting portion at which the outer peripheral edge of the first substrate(10) projects outside that of the second substrate(20). First, a fluid is ejected to the projecting portion to form a separation start portion(40), and then, separation is started from the separation start portion(40) while rotating the bonded substrate stack(30). 公开号:KR20000057896A 申请号:KR1020000005288 申请日:2000-02-02 公开日:2000-09-25 发明作者:야나기타카즈타카；오오미카즈아키；사카구찌키요후미；쿠리스히로카즈 申请人:미다라이 후지오；캐논 가부시끼가이샤； IPC主号:
专利说明:
COMPOSITE MEMBER AND SEPARATING METHOD THEREFOR, BONDED SUBSTRATE STACK AND SEPARATING METOD THEREFORE, TRANSFER METHOD FOR TRANSFER LAYER, AND SOI SUBSTRATE MANUFACTURING METHOD} The present invention relates to a composite member and a separation method thereof, a bonded laminated substrate and a separation method thereof, a relocation method of the relocation layer and a method for producing an SOI substrate. As a substrate having a single crystal Si layer on an insulating layer, a substrate (SOI substrate) having a silicon on insulator (SOI) structure is known. Devices using SOI substrates have many advantages that cannot be obtained using conventional Si substrates. An example of this is as follows. (1) Since the insulator is easily separated, the degree of integration can be increased. (2) The reflection resistance can be increased. (3) Due to the small mammal capacity, it is possible to speed up the operation speed of the device. (4) There is no need for a well step. (5) Latch-up can be prevented. (6) A complete depletion type field effect transistor can be formed by thin film formation. Since SOI substrates have the various advantages described above, research on their preparation has been ongoing for decades. As one SOI technique, a silicon on sapphire (SOS) technique in which Si is heterogeneously laminated and grown by CVD (chemical vapor deposition) on a single crystal sapphire substrate has been known for a long time. The SOS technology has earned a reputation as the most complete SOI technology. However, for example, a large amount of crystal defects are generated by lattice mismatch at the interface between the Si layer and the lower sapphire layer, and when the aluminum constituting the sapphire substrate is mixed with the Si layer, the substrate is expensive and has a large area. Since it is difficult to obtain the SOS technology has not been put to practical use. Recently, attempts have been made to realize an SOI structure using no sapphire substrate at all. The attempts are roughly classified in two ways. In the first method, the surface of a single crystal Si substrate is oxidized, and openings are formed in the oxide film (SiO 2 layer) to partially expose the Si substrate. By using the exposed portion as a seed and growing to stack single crystal Si laterally, a single crystal Si layer is formed on SiO 2 (in this method, a Si layer is deposited on the SiO 2 layer). In the second method, a single crystal Si substrate itself is used as an active layer to form an SiO 2 layer on the lower surface of the substrate (in this method, no Si layer is deposited). As a means for realizing the first method, a method of growing a single crystal Si layer laterally from a single crystal Si layer by lamination by a CVD method, and depositing an amorphous Si layer and monocrystalline in the cross direction in a solid state by annealing A method of growing Si in a lamination (solid epitaxial growth method), and irradiating a focused Si energy beam such as an electron beam or a laser beam to an amorphous Si layer or a polycrystalline Si layer to melt a recrystallization to form a single crystal Si layer on a SiO 2 layer. A method of growing (beam annealing method) and a method of scanning a band-shaped molten region by a rod-shaped heater (band melt recrystallization method) are known. These method modes have many problems such as advantages and disadvantages, controllability, productivity, uniformity and quality, and thus have not been put to practical use in industrial applications. For example, CVD requires sacrificial oxidation to form flat thin films. Solid state epitaxial growth is weak in crystallinity. In beam annealing, the processing time required for scanning the focused beam and the controllability for beam overlapping and focusing become a problem. The band melt recrystallization method is the most mature technology, and a relatively large scale integrated circuit has been manufactured based on the method. However, since a large number of crystal defects, such as subboundary, exist unavoidably, a minority carrier element cannot be produced. As a second method, for example, the following four techniques are used as a method in which a Si substrate is not used as a seed for epitaxial growth. As a first technique, an oxide film is formed on a single crystal Si substrate having a V-shaped groove formed on its surface by anisotropic etching. A polysilicon layer having a thickness almost equal to the thickness of the single crystal Si substrate is deposited on the oxide film. Next, by polishing the single crystal Si substrate from the lower surface, a substrate having a single crystal Si region surrounded by and insulated by V-shaped grooves is formed on the thick polysilicon layer. Through the above technique, it is possible to form a substrate having satisfactory crystallinity. However, there is a problem of controllability and productivity in connection with a process of depositing a polysilicon layer to a thickness of several hundred microns or a process of polishing a single crystal Si substrate from a lower surface to leave an isolated Si active layer. The second technique is SIMOX (separation by oxygen ion implantation). In this technique, oxygen ions are implanted into a single crystal Si substrate to form a SiO 2 layer. In this technique, in order to form a SiO 2 layer on a substrate, oxygen ions must be implanted at a dosage of 10 18 (ion / cm 2) or more. This injection takes a long time, resulting in low productivity and high manufacturing costs. In addition, since a large number of crystal defects are generated, the quality is considerably degraded, making it impossible to manufacture a minority carrier element. As a third technique, an SOI substrate is formed by dielectric separation by oxidizing a porous Si layer. In this technique, n-type Si islands are formed on the surface of a P-type single crystal Si substrate by quantum ion implantation (Imai et al. J. crystal Growth, vol. 63,547 (1983)) or epitaxial growth and patterning. The substrate is anodized in HF solution to convert only the P-type silicon substrate around the n-type silicon island into a porous structure. Next, the n-type silicon island is insulated from each other by accelerated oxidation. In this technique, since the Si region to be separated must be determined before the element processing step, the degree of freedom in element design is limited. As a fourth technique, an SOI substrate is formed by joining a single crystal Si substrate and another thermally oxidized single crystal Si substrate by annealing or an adhesive. In this technique, the active layer forming the element becomes uniformly thin. More specifically, a single crystal Si substrate having a thickness of several hundred microns becomes thinner to a micron order or less. To thin the substrate, a polishing method or selective etching may be used. It is very difficult to uniformly thin a single crystal Si substrate by polishing. In particular, when the film is thinned down to a submicron level, the variation range is several ten percent. As the wafer size increases, the difficulty becomes more difficult. Selective etching is effective to uniformly thin the substrate. However, since the selectivity is as low as 10 2 , the surface flatness after etching is weakened, and the crystallinity of the SOI layer is also poor. A light transmissive substrate represented by a glass substrate is important for constructing a contact sensor or a projection liquid crystal display device such as a light receiving element. In order to realize a high definition pixel having a high density and a high resolution for a sensor or a display device, a high performance driving element is required. For this purpose, a technique for forming a single crystal Si layer having excellent crystallinity on a light transmissive substrate is required. However, when an Si layer is deposited on a light-transmissive substrate represented by a glass substrate, only an amorphous Si layer or a polycrystalline Si layer is obtained. This is because the light transmissive substrate has an amorphous structure, and the Si layer formed on the substrate reflects irregularities in the crystal structure of the light transmissive substrate. The present applicant has disclosed a new SOI technology in Japanese Patent Laid-Open No. 5-21338. In this technique, a first substrate obtained by forming a porous layer on a single crystal Si substrate and a nonporous layer on the substrate is bonded to the second substrate through an insulating layer. Next, the non-porous single crystal layer is transferred to the second substrate by separating the bonded laminated substrate into two substrates in the porous layer. This technique is excellent in the uniformity of the film thickness of the SOI layer, so that the density of crystal defects in the SOI layer can be reduced, the surface flatness of the SOI layer is excellent, and no expensive manufacturing apparatus having special specifications is needed, and there are several hundred A. There is an advantage that a SOI substrate having an SOI film having a thickness of 10 to 10 mu m can be manufactured by a single manufacturing apparatus. In Japanese Patent Application Laid-Open No. 7-302889, the first and second substrates are bonded together, the first substrate is separated from the second substrate without damaging the first substrate, and the surface of the separated first substrate is removed. A technique for smoothing, re-forming a porous layer on a first substrate, and reusing the substrate has been disclosed. Since the first substrate is not disposed of, this technique has the advantage of greatly reducing the manufacturing cost and simplifying the manufacturing process. In order to separate the bonded laminated substrate into two substrates without damaging the first substrate and the second substrate, for example, a force is applied in a direction perpendicular to the bonded surface, and a shearing force is applied to the bonded surface. Tensioning the two substrates in the opposite direction during application (i.e., moving the two substrates in both directions in a plane parallel to the bonding surface, or rotating the two substrates in the opposite direction while applying a force in the circumferential direction, Alternatively, pressure is applied in a direction perpendicular to the bonding surface, and wave energy such as ultrasonic waves is applied to the separation region, or a peeling member (for example, a sharp blade such as a knife) is attached from the surface of the side surface of the bonding substrate. Porous material acting as separation region or using expansion energy of a material inserted into a separation zone parallel to the hole, or filling a hole in the porous layer acting as a separation zone Expanding the volume of the porous layer to the thermally oxidized from the side surface of the bonded substrate stack and substrate are separated, or separated substrate by the porous layer is selectively etched away from the outer surface of the bonded substrate stack to act as a separation zone. The porous Si layer was discovered by Euler et al. In 1956 during the course of electropolishing of semiconductors (A. Uhlir. Bell Syst. Tech. J., vol. 35,333 (1956)). Porous Si is formed by anodizing a Si substrate in an HF solution. Unagami et al. Studied the dissolution reaction of Si during anodization and reported that holes were required for anodization of Si in HF solution. Si + 2HF + (2-n ) e + → SiF 2 + 2H + + ne - SiF 2 + 2HF → SiF 4 + H 2 SiF 4 + 2HF → H 2 SIF 6 or Si + 4HF + (4-λ ) e + → SiF 4 + 4H + + λe - SiF 4 + 2HF → H 2 SiF 6 Equation (T. Unagumi, J. Electrochem, SOC., Vol. 127,476 (1980)) Where e + and e − represent the holes and electrons, respectively, and n and λ are the number of holes required to dissolve Si 1 atoms. According to these, porous Si is formed when n> 2 or (lambda)> 4. This fact implies that the p-type Si with the pores is converted to porous silicon but the n-type silicon is not. Selectivity in the transformation has been reported by Nagona et al. And Imai et al. (Nagano, Nakajima, Anno, Onaka, Kajiwara, Institute of Electronics and Telecommunications Research, vol. 79, SSD79-9549 (1979)) (K. Imai) , solid-state Electronics, vol. 24,159 (1981). However, it has also been reported that high concentrations of n-type silicon are converted to porous silicon (R. P. Holmstrom and J. Y. Chi. Appl. Lett., Vol. 42,386 (1983)). Therefore, it is important to select a substrate that can be converted into a porous Si substrate regardless of P type or N type. In order to form the porous layer, in addition to the above anodization method, ions may be implanted into the silicon substrate. For example, in the method described in Japanese Patent Laid-Open No. 5-21338, that is, a substrate obtained by bonding a first substrate and a second substrate having a non-porous layer such as a single crystal Si layer on a porous layer through an insulating layer. In the method of separating (hereinafter referred to as a bonded laminated substrate) from the porous layer and thereby transferring the non-porous layer formed on the first substrate side to the second substrate, a technique of separating the bonded laminated substrate is very important. For example, when separating a bonded laminate substrate, if separated in a portion other than the porous layer as a separation layer, a non-porous layer (for example, a single crystal Si layer) used as an active layer is destroyed, thereby obtaining a desired SOI substrate. Can't. 1A is a schematic view for explaining a step of forming a porous layer in a method of manufacturing an SOI substrate according to a preferred embodiment of the present invention. 1B is a schematic view for explaining a step of forming a single crystal Si layer and an insulating layer in the method for producing an SOI substrate according to a preferred embodiment of the present invention. 1C is a schematic diagram illustrating a bonding step in the method for producing an SOI substrate according to a preferred embodiment of the present invention. 1D is a schematic view for explaining a step of forming a separation start area (preliminary separation step) in a method for producing an SOI substrate according to a preferred embodiment of the present invention. 1E is a schematic view for explaining a separation step (main separation step) in the method for producing an SOI substrate according to a preferred embodiment of the present invention. Fig. 1F is a schematic view for explaining a step of removing the SOI substrate and the porous layer on the second substrate side in the method for producing an SOI substrate according to a preferred embodiment of the present invention. Fig. 1G is a schematic view for explaining a step of removing a porous layer on a side of a first substrate in a method for producing an SOI substrate according to a preferred embodiment of the present invention. Fig. 2 is a perspective view showing an example of a bonded laminated substrate having protrusions formed by joining first and first substrates whose center positions are shifted. 3 is a view schematically showing the formation of a separation start portion on the bonded substrate stack shown in FIG. FIG. 4 is a diagram schematically illustrating the separation of the bonded laminate substrate shown in FIG. 3. FIG. FIG. 5 shows an example of a bonded laminate substrate having protrusions formed by bringing a first substrate and a second substrate smaller than the first substrate into close contact with each other. FIG. FIG. 6 is a view schematically showing the formation of a separation start portion on the bonded substrate stack shown in FIG. 5; FIG. FIG. 7 is a schematic view showing separation of the bonded substrate stack shown in FIG. 6; FIG. 8 is a diagram showing a schematic configuration of a processing apparatus according to another preferred embodiment of the present invention. 9 is a view showing a schematic configuration of a processing apparatus according to another preferred embodiment of the present invention. <Explanation of symbols for main parts of drawing> 10: first substrate 20: second substrate 30: bonded laminated substrate 40: separation start 50: SOI substrate 11: single crystal Si substrate 12: porous layer 13: single crystal Si layer 14: insulation layer (SiO 2 layer) 100, 200, 300: processing apparatus 101, 102: rotation shaft 103, 104: substrate support 105: injection nozzle 201: support 202: elastomer 203: support 210: wedge 301: treatment tank 302: vibration source 303: vibration energy transmission medium The present invention has been made in view of the above circumstances, and an object thereof is to enable a composite member such as a bonded laminated substrate to be suitably separated from a separation layer such as a porous layer. According to the first aspect of the present invention, in the method for separating a composite member having a structure in which a first member having a separation layer therein is in close contact with a second member, the composite member may include an outer peripheral portion of the first member. And a protruding portion protruding outward of the outer circumferential portion of the two members, wherein the separating method includes a separating step of starting the separation of the composite member from the protruding portion and separating the composite member into two members in the separating layer. Separation method. In the method for separating a composite member according to the first aspect of the present invention, for example, the main surface of the first member has the same shape as the main surface of the second member, and the composite member has a main surface and the first surface of the first member. It is preferable to have a structure in which the main surfaces of the two members are brought into close contact with each other while the center position is shifted from each other. In the method for separating a composite member according to the first aspect of the present invention, for example, the main surface of the second member is smaller than the main surface of the first member, and the composite member is formed of the main surface of the first member and the second member. It is preferable to have a structure which adheres to the periphery. In the method for separating a composite member according to the first aspect of the present invention, for example, the separation step may include a preliminary separation step of forming a separation start portion by treating the protrusion, and substantially separating the composite member from the separation start portion to substantially separate the separation layer. It is preferred to include a main split step that breaks and separates the composite member into two members in the separation layer. According to the second aspect of the present invention, the composite member manufacturing method includes joining a first member having a separation layer therein to a second member so that the outer peripheral portion of the first member has a protrusion that protrudes outward of the outer peripheral portion of the second portion. It is characterized by comprising a composite member. According to the third aspect of the present invention, the method of relocating the relocation layer on the surface of the first member to the second member includes a first member having a separation layer therein and a relocation layer on the separation layer in close contact with the second member. A preliminary step of manufacturing a composite member in which the outer circumference of the first member protrudes outward of the outer circumference of the second member, and starting the separation of the composite member from the protrusion and separating the composite member into two members in the separation layer. And a separating step for relocating the moving layer to the second member. According to a fourth aspect of the present invention, in the separation method for separating a bonded laminated substrate formed by bringing a first substrate having a separation layer therein and a separation layer in the separation layer to a second substrate into two substrates, The bonded laminated substrate has a protrusion in which the outer portion of the first substrate protrudes to the outside of the outer periphery of the second substrate, and the separation method starts a separation step of separating the bonded laminated substrate into two substrates in the separation layer by initiating separation from the protrusion. Separation method characterized in that it comprises. In the method of separating the bonded laminate substrate according to the fourth aspect of the present invention, for example, the first substrate has the same size as that of the second substrate, and the bonded laminate substrate shifts the center position of the first substrate and the second substrate. It is preferable to have a structure in close contact during the process. In the separation method of the bonded laminated substrate according to the fifth aspect of the present invention, for example, the bonded laminated substrate preferably has a structure in which the first substrate and the second substrate smaller than the first substrate are in close contact with each other. In the separation method of the bonded laminate substrate according to the fifth aspect of the present invention, for example, the second substrate has one orientation flat or notch, and the bonded laminate substrate is formed of an orientation flat or notch of the second substrate. It is preferable to have, as protrusions, a portion where the first substrate is exposed to the presence. In the separation method of the bonded laminate substrate according to the fifth aspect of the present invention, for example, each of the first and second substrates has one orientation flat or notch, and the orientation flat or notch of the first substrate and the second substrate. The bonded laminate substrate formed by bringing the first substrate and the second substrate into close contact with each other without matching the orientation flat or notch of the substrate is a portion where the first substrate is exposed to the presence of the orientation flat or notch of the second substrate. It is preferable to have as a protrusion. According to the sixth aspect of the present invention, in the method for manufacturing a bonded laminate substrate, a separation layer and a separation layer of a first substrate having a separation layer on the separation layer and a second substrate are bonded to each other so that an outer peripheral portion of the first substrate is formed. Provided is a manufacturing method, characterized in that the bonded laminated substrate having a protrusion projecting to the outside of the outer peripheral portion of the two substrates. According to a seventh aspect of the present invention, a relocation method of relocating a relocation layer on a surface of a first substrate to a second substrate includes a separation layer of a first substrate having a separation layer therein and a relocation layer on the separation layer. A preliminary step of manufacturing a bonded laminate substrate having a protrusion in which the outer periphery of the first substrate protrudes outwardly to the outer periphery of the second substrate in close contact with the two substrates; and separating and starting the bonded laminate substrate from the protrusion to bond in the separation layer. By separating the laminated substrate, there is provided a separation step of providing a separation step for moving the moving layer of the first substrate to the second substrate. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the preliminary step may be provided by making a bonded laminate substrate by bringing the first substrate and the second substrate of the same size into close contact with each other while shifting the center position. It is desirable to. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the preliminary step may include preparing the laminated substrate by closely contacting the first substrate and a second substrate smaller than the first substrate. desirable. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the first substrate is brought into close contact with a second substrate having either an orientation flat or a notch, so that the first substrate is aligned with the second substrate. It is preferable to prepare and provide a bonded laminated substrate having a portion exposed to the presence of a flat and a notch as protrusions. In the method of relocation of the relocation layer according to the seventh aspect of the present invention, for example, a first substrate and a second substrate are manufactured, and an orientation flat or notch of the first substrate coincides with an orientation flat or notch of the second substrate. It is preferable that the first substrate and the second substrate are brought into close contact with each other to produce a bonded laminated substrate. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the separation step may be performed by processing the protrusion to form a separation start portion and initiating separation of the bonded laminated substrate from the separation start portion to substantially remove the separation start layer. It is preferable that the preliminary separation step of separating the bonded substrate stack by separating the two substrates into two substrates in the separation layer. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the preliminary separation step is preferably provided by injecting a fluid into the protruding portion to form the separation start portion with the fluid. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the preliminary separation step may include a wedge-shaped member inserted between the first substrate and the second substrate in the protrusion to form a separation start portion. It is preferable to provide. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the preliminary separation step may include a wedge-shaped member inserted between the first substrate and the second substrate in the protrusion to form a separation start portion. It is preferable to provide. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the preliminary separation step may be provided by dipping the projection into a fluid to supply vibration energy to the projection through the fluid to form a separation start section. Do. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the separation start portion is preferably a portion having the weakest portion in the separation start portion. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the separation start portion is preferably a portion where the separation layer is removed from the separation start portion and the separation layer that is the lower layer of the separation layer is exposed. In the method of relocating the relocation layer according to the seventh aspect of the present invention, for example, the separation start portion may be a portion in which the separation layer is exposed at the separation start portion, and the outer peripheral portion of the separation layer is disposed inside the bonded laminated substrate. desirable. In the relocation method of the relocation layer by the 7th side of this invention, it is preferable that a separation layer is a porous layer, for example. In the method of relocating a relocation layer according to the seventh aspect of the present invention, for example, the first substrate is formed by subjecting the substrate to anodization treatment to form a porous layer as a separation layer and a relocation layer on the separation layer. It is preferable that it is a board | substrate. In the method of moving the moving layer according to the seventh aspect of the present invention, for example, the first substrate preferably has a porous layer formed by ion implantation as a separation layer. In the method of moving the moving layer according to the seventh aspect of the present invention, for example, the moving layer preferably includes a single crystal Si layer. In the moving method of the moving layer by the 7th side of this invention, for example, it is preferable that the said moving layer has a single crystal Si layer and an insulating layer sequentially as a moving layer. According to the eighth aspect of the present invention, in the method for producing an SOI substrate, an outer peripheral portion of the first substrate is formed by bringing the surface of the first substrate and the second substrate into close contact with the surface of the first substrate having a porous layer therein and including a single crystal Si layer on the porous layer. A preliminary step of manufacturing a bonded laminate substrate having protrusions protruding to the outer axis of the second substrate outer periphery, and starting the bonded laminate substrate from the protrusions to separate the bonded laminate substrate from the porous layer, thereby removing the separated layer of the first substrate. A separation step for relocating to a second substrate and a removal step for removing a porous layer remaining on the surface of the second substrate after separation are provided. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the first substrate preferably includes an insulating layer as well as a single crystal Si layer on the single crystal Si substrate as a moving layer. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the second substrate preferably has an insulating layer on its surface. In the method for manufacturing an SOI substrate according to the eighth aspect of the present invention, for example, the preliminary step may be provided by manufacturing a bonded laminate substrate by bringing the first substrate and the second substrate of the same size into close contact with each other. It is desirable to. In the method for manufacturing an SOI substrate according to the eighth aspect of the present invention, for example, the preliminary step may be provided by manufacturing a bonded laminate substrate by bringing the first substrate into close contact with the second substrate smaller than the first substrate. It is preferable. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the preliminary step is preferably provided in close contact with the first substrate and the second substrate while keeping the center positions of the two substrates. In the method for manufacturing an SOI substrate according to the eighth aspect of the present invention, for example, the preliminary step may be in close contact with the first substrate and the second substrate having one of the orientation flats or notches, and the orientation flat of the second substrate may be It is preferable to manufacture and provide a bonded laminated substrate having, as protrusions, a portion where the first substrate is exposed in the presence of a notch. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the preliminary step may be performed by manufacturing a first substrate and a second substrate each having one of an orientation flat and a notch, and the orientation flat of the first substrate. Alternatively, the first substrate and the second substrate may be brought into close contact with each other so as to produce a bonded laminated substrate without matching the notch with the orientation flat and the notch of the second substrate. In the method for manufacturing an SOI substrate according to the eighth aspect of the present invention, for example, the separation step may include a process of forming a separation start portion by processing the protrusion, and separating and starting the laminated substrate from the separation start portion to substantially remove the porous layer. It is preferable to provide a preliminary separation step of breaking and separating the bonded laminated substrate into two substrates in the porous layer. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the preliminary separation step is preferably provided by injecting a fluid into the protruding portion to form a separation start portion by the fluid. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the preliminary separation step is provided by forming a separation start portion by inserting a wedge-shaped member into a gap between the first substrate and the second substrate at the protrusion. It is desirable to. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the preliminary separation step is preferably provided by applying a vibration energy to the protruding portion to form a separation start portion. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the preliminary release step preferably includes a separation start portion formed by immersing the protrusion in the fluid and applying vibration energy to the protrusion through the fluid. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, water is preferably used as the fluid. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, it is preferable that the preliminary separation step includes a separation start portion formed by etching the moving layer and the porous layer in the protrusion. In the method for manufacturing an SOI substrate according to the eighth aspect of the present invention, for example, by injecting a fluid into the protrusion, a separation start part is formed on the bonded laminated substrate, and the separation of the bonded laminated substrate is performed while changing the position at which the fluid is injected. It is desirable to. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the separation step includes a wedge-shaped member inserted into the gap between the first substrate and the second substrate at the protrusion to separate the bonded laminate substrate. It is preferable to provide. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, it is preferable that the separation start portion be a portion in which the porous layer has the weakest structure in the separation start portion. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the separation start portion is preferably a portion where the separation layer is removed from the separation start portion and the porous layer under the separation layer is exposed. In the SOI substrate manufacturing method according to the eighth aspect of the present invention, for example, the separation start portion is preferably a portion in which the porous layer is exposed at the separation start portion and the outer circumferential portion of the porous layer is located inside the bonded laminated substrate. Do. According to the ninth aspect of the present invention, in a composite member having a structure for joining a first member and a second member having a separation layer therein, a protrusion part of which the outer peripheral part of the first member protrudes outward of the outer peripheral part of the second member It provides a composite member characterized in that provided. According to an eleventh aspect of the present invention, there is provided a bonded laminated substrate formed by connecting a surface of a first substrate and a second substrate having a porous layer therein and a relocation layer including a single crystal Si layer on the porous layer. It provides a composite member, characterized in that the outer peripheral portion of the substrate has a protrusion projecting to the outside of the second substrate outer peripheral portion. Further objects, features, and advantages of the present invention will become apparent from the detailed description of the present invention described with reference to the accompanying drawings. (Detailed Description of the Preferred Embodiments) Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. 1A to 1E are schematic diagrams illustrating a method for manufacturing an SOI substrate according to a preferred embodiment of the present invention. In the step shown in Fig. 1A, a single crystal Si substrate 11 is produced, and for example, a porous Si layer 12 is formed on the surface of the single crystal Si substrate by anodization. In the step shown in Fig. 1B, a non-porous Si substrate 13 is formed on the porous Si layer by epitaxial growth. The surface of the non-porous single crystal Si 13 is oxidized to form an insulating layer (SiO 2 ) 14. By the above process, the first substrate 10 is formed. The porous Si layer 12 may be formed by, for example, a method of implanting hydrogen ions, helium ions or an inert gas into the single crystal Si substrate 11 (ion implantation method). The porous Si layer formed by such a method is called a microcavity layer because it has a large number of microcavities. In the step shown in FIG. 1C, the second substrate 20 of single crystal Si is manufactured, and the laminated layer is brought into close contact with the first substrate 10 at room temperature while facing the second substrate 20. Form a substrate. In a preferred embodiment of the present invention, the bonded substrate stack 30 is formed. The bonded laminated substrate 30 is a part (hereinafter, referred to as a protrusion) in which the outer circumferential portion of the first substrate having the porous layer 12 is partially located outside the second substrate 20 as a separation layer (separation layer). ) In order to manufacture the laminated substrate 30 in this manner, for example, the following method is preferably used. (1) While shifting the center of the substrate, the first substrate is brought into close contact with the second substrate 20 having the same size as that of the first substrate. (2) The first substrate 10 is brought into close contact with the second substrate 20 smaller than the first substrate. (3) A substrate having a notch or orientation flat is used as the second substrate 20. The surface of the first substrate 10 is exposed to the notches or orientation flats of the second substrate. In this case, the outer peripheral portion of the first substrate 10 protrudes outward from the outer peripheral portion of the second substrate in the notch or orientation flat of the second substrate. (4) After joining the first substrate 10 and the second substrate 20, part or all of the outer peripheral portion of the second substrate is polished. In the method of (3), a substrate having a notch and an orientation flat is used as the first substrate 10, and the notch or orientation flat of the first substrate 10 is a notch or orientation plate of the second substrate 20. Lay the two substrates so that they do not match. 1C schematically shows an example of a method of bringing the first substrate 10 and the second substrate 20 having the same size into close contact with each other while shifting their center positions. The protrusion amount D of a part of the first substrate 10 may be, for example, about 0.1 mm to 0.5 mm and larger. FIG. 2 is a perspective view schematically showing an example of the bonded substrate stack 30 shown in FIG. 1C. FIG. 5 is a perspective view showing an example of the bonded laminated substrate 30 formed by bringing the first substrate 10 and the second substrate 20 smaller than the first substrate 10 into close contact with each other while matching the center positions thereof. . Unlike the state obtained by bringing the first substrate and the second substrate into close contact with each other as shown in FIG. 1C, the insulating layer 14 is on the single crystal Si layer 13 side or the single crystal Si layer 13 and the second substrate ( 20) may be formed on both sides. However, when the insulating layer 14 is formed on the single crystal Si layer 13 side serving as an active layer, a high quality SOI substrate can be obtained. This is because the bonding interface between the first substrate 10 and the second substrate 20 can be separated from the active layer. In the step shown in Fig. 1D, a separation start portion 40, which is a portion at which separation starts, is formed in the protrusion. More specifically, in order to form the separation start portion 40, at least a part of the relocation layer (the single crystal Si layer 13 and the insulating layer 14) in the protruding region of the first substrate 10 is removed and relocated. The layer and the porous layer can be selectively removed. In order to form the separation start section 40, for example, the following method is preferably used. (1) The fluid is sprayed on the protrusion to destroy and remove the permeable layer and the lower porous layer from the protrusion. (2) The wedge is inserted in the vicinity of the bonding interface between the first substrate 10 and the second substrate 20 at the protruding portion, thereby destroying and removing the moving layer and the lower porous layer 12. (3) Vibration energy such as ultrasonic waves is applied to the protruding portion to destroy the porous layer at this protruding portion, and peel off the moving layer on the porous layer 12. (4) The protrusions are immersed in the etching solution, and the moving layer and the lower porous layer 912 are etched and removed. Referring to Fig. 10, 12a is a porous layer after formation of the separation start section 40; Reference numeral 13a denotes a single crystal Si layer of the separation start portion 40 forming portion, and 14a is an insulating layer after formation of the separation start portion 40. The separation start section 40 preferably has a structure in which only the porous layer is broken in the next separation step so that the bonded substrate stack can be separated into two substrates. Alternatively, the separation start unit 40 may be more susceptible to the porous layer 12 from being more mechanically vulnerable, such as the single crystal layer 13a, the insulating layer 14a, the second substrate 20, the single crystal Si substrate and the interface between the layers or the substrate. It is desirable to be a part. More specifically, the separation start unit 40 preferably has a structure in which the porous layer 12 is exposed to the surface of the side of the bonded substrate stack. More preferably, as shown in FIG. 1D, the outer circumferential portion of the porous layer 12 is positioned inside the outer circumferential portion of the receding layer. When the bonded substrate stack 30 having the protrusion is formed, the moving layer and the lower porous layer can be easily removed at that portion. This is because the moving layer of the protrusion is exposed more than the moving layer of the remaining portion. Therefore, when the bonded substrate stack with protrusions is formed, the separation start portion can be easily formed. When the separation start portion is formed, the porous layer 12 can be selectively destroyed in order to separate the bonded substrate stack in the next separation step. This effectively prevents defects in the separation step. In the step shown in Fig. 1E, for the bonded laminated substrate having the separation start portion 40, separation is started in the porous layer 12 of the separation start portion 40. Finally, the bonded substrate stack is completely separated into two substrates in the porous layer 12. In order to separate a laminated substrate, for example, the following method is preferably used. (1) Separation method using fluid For example, a flow of a fluid such as a liquid such as water or a gas such as air or nitrogen is injected into the gap at the outer peripheral portion of the bonded laminate substrate. The bonded substrate stack is separated into two substrates in the porous layer 12 by a fluid. (2) Separation method using wedge For example, when a thin wedge made of resin is gradually inserted into the gap at the outer periphery of the bonded laminated substrate, a suitable laminated substrate is separated into two substrates in the porous layer 12. (3) Separation method by peeling One surface of the bonded laminate substrate is fixed, and the other surface thereof is pulled in the axial direction of the bonded laminate substrate using a flexible tape or the like to separate the bonded laminate substrate from the porous layer. (4) Separation method using shear stress The bonded laminated substrate can be separated from the porous layer by shear stress by fixing one surface of the bonded laminated substrate and applying a force to the other surface to move the other surface in the planar direction of the bonded laminated substrate. The separation start portion forming step (preliminary separation step) shown in FIG. 1D and the separation step (main separation step) shown in FIG. 1E may be executed continuously by a single processing apparatus. For example, it is preferable to perform the separation start forming step (preliminary separation step) and the separation step (main separation step) continuously by using a fluid such as water using a water injection device, which is a separation device using a fluid. Do. As described above, after the separation start portion is formed, if the separation process starts from the separation start portion, the bonded substrate stack can be substantially separated only from the porous layer. Therefore, it is possible to prevent breakage (creation of defects) of the interface between the single crystal layer 13a, the insulating layer 14a, the second substrate 20, and the single crystal Si substrate 11 and the layer or between the substrates. In the case of using a bonded laminated substrate having a protrusion, when the separation start portion is first formed in the protrusion, and when total separation starts from the separation start portion, the bonded laminated substrate can be substantially separated only from the porous layer. Therefore, it is possible to prevent the single crystal layer 13, the insulating layer 14, the second substrate 20, the single crystal Si substrate 11, and the interface between the layers or the substrate from being destroyed. When the bonded laminated substrates formed by bringing the second substrates having the same size as the first substrate 10 into close contact with each other with the notches or the orientation flats are directly separated, the single crystal Si layer 13, the insulating layer 14, The interface between the second substrate 20, the single crystal Si substrate 11, and the layer or the substrate may be destroyed to cause defects. Such a phenomenon may occur due to the following mechanism. In the bonded substrate stack, it is ideal that the porous layer 12 is the weakest. In practice, for example, due to stresses and dips between the porous layer 12, the single crystal Si layer 13, the insulating layer 14, and the second substrate 20, the porous layer 12 and Likewise, a weaker portion and a portion more vulnerable than the porous layer 12 (hereinafter, referred to as defect inducing parts) may be generated. Such defect attracting parts are first destroyed during the separation treatment, causing defects. The defect is easily generated at the portion at which the separation treatment is started, for example, at the portion at which the force (separation force) for separation is first applied. The same force acts on the porous layer 12, the single crystal Si layer 13, the insulating layer 14, and the second substrate 20 at the portion where the separation treatment is started, for example, the outer periphery of the bonded laminated substrate. For this reason, if a defect attracting part exists, the probability of breaking before the porous layer 12 may be very high. As the separation process proceeds, the force for separation (separation force) acts intensively on the porous layer 12, which is the weakest layer of average strength, and the separation force hardly acts on the rest. Thus, the porous layer 12 is selectively separated regardless of the presence of the defect inducing portion. As in the present embodiment, it is preferable to form the bonded laminated substrate 30 having the protrusions, to form the separation start portion in the protrusions, and to start the continuous separation treatment from the separation start portion 40. In the separation step shown in FIG. 1E, the first substrate 10 'after separation has a structure in which a porous Si layer 12b is formed on the single crystal Si substrate 11. On the other hand, after separation, the second substrate 20 has a multilayer structure of the porous layer 12c / single crystal Si layer 13b / insulating layer 14b / single crystal Si substrate 20. That is, in the treatment process, the single crystal Si layer 13 and the insulating layer 14 on the porous layer 12 of the first substrate may be transferred to the second substrate. The porous layer 12 is one example of a separation layer, and the single crystal Si layer 13 and the insulating layer 14 are one example of a transfer layer transferred from the first substrate to the second substrate. In the step shown in FIG. 1F, the porous layer 12 on the surface of the second substrate 20 'after separation is selectively removed. By carrying out this processing step, an SOI substrate 50 having a multilayer structure of a single crystal Si layer 13b / insulation layer 14 / single crystal Si substrate 20, that is, an SOI substrate 50 having an SOI structure is obtained. Can be. In the step shown in Fig. 1G, the porous layer 12b on the single crystal Si substrate 11 of the first substrate 10 'after separation is selectively removed by, for example, etching. The single crystal Si substrate 11 obtained by this method can be used again as a substrate used for forming the first substrate or the second substrate again. As described above, according to this embodiment, the bonded laminated substrate having the lead-out portion is formed, and the separation start portion is formed in the protruding portion at the start of the separation start portion. In the subsequent separation process, since the separation start unit is destroyed first, defects can be prevented. A processing apparatus suitable for the execution of the separation start portion forming step (preliminary separation step) and separation step (main separation step) shown in FIGS. 1D and 1E will be described below. [First Processing Equipment] 3, 4, 6, and 7 are diagrams schematically showing the configuration of the bonded laminate substrate processing apparatus according to the preferred embodiment of the present invention. 3 and 4 show an example of the processing for the bonded substrate stack 30 shown in FIG. 6 and 7 show an example of a process for the bonded substrate stack shown in FIG. The processing apparatus 100 shown in FIGS. 3, 4, 6, and 7 has a pair of substrate support portions 103 and 104. The bonded substrate stack is pressed from both sides by the substrate support portions 103 and 104. The substrate supports 103, 104 are respectively connected to a rotating shaft which is rotatably held in the axial direction. At least one of the rotary shafts 101 and 102 applies an pressure to the bonded substrate stack 30 and increases or decreases an interval between the substrate support 30 and the substrate support 104 (eg, an air cylinder). ) At least one of the rotation shafts 101 and 102 is connected to the rotation shaft of the rotation source (for example, a motor). The bonded substrate stack 30 may be rotated by a driving force generated by the rotation source. The processing apparatus 100 has an injection nozzle 105 for injecting a liquid such as water or a gas such as air or nitrogen, that is, a fluid. The injection nozzle 105 preferably has a diameter of about 0.1 mm, for example. Devices that use water as a fluid are specifically referred to as water spray devices. When the processing apparatus 100 is used for the separation start forming step (preliminary separation step) shown in FIG. 1D, the projection of the bonded laminated substrate 30 as shown in FIG. 3 or FIG. While being positioned opposite to 105, the bonded substrate stack 30 is fixed. In this state, the fluid is injected from the injection nozzle 105 to the protrusion of the bonded substrate stack 30. When the processing apparatus 100 is used in the separation step (main separation step) shown in FIG. 1E, as shown in FIG. 4 or FIG. 7, the separation start unit 40 faces the injection nozzle 105. A bonded laminated substrate 30 having a separation start portion 40 is provided. In this state, fluid is injected from the injection nozzle 105 to the separation start section 40. Subsequently, the bonded bonded substrate substrate 30 is separated while being rotated. When the processing apparatus 100 is used continuously in the separation start forming step (preliminary separation step) and separation step (main separation step), first, the bonded laminated substrate is fixed, and in this state, it is shown in FIG. As shown, the fluid is injected from the injection nozzle 105 to the bonded substrate stack 30. When the separation start section 40 is formed, as shown in Fig. 4 or 7, the bonding laminated substrate 30 is rotated to transfer the processing to the separation step (main separation step). Next, the bonded laminated substrate 30 is completely separated from the porous layer while rotating the bonded laminated substrate 30. Second Processing Equipment 8 is a diagram schematically showing the configuration of a bonded laminate substrate processing apparatus according to another preferred embodiment of the present invention. The processing apparatus 200 shown in FIG. 8 includes a support table 201 having a support portion 203 for supporting the bonded laminate substrate 30, and a pressing table 30 for pressing the bonded laminate substrate 30 against the support portion 203. An elastic body and a wedge are provided. When the processing apparatus 200 is used in the separation start portion forming step (preliminary separation step) shown in Fig. 1D, the opposite side of the projection of the bonded laminated substrate 30 is supported by the support portion 203. In this state, the wedge is appropriately inserted by the predetermined amount in the vicinity of the joining interface of the bonded laminated substrate at the protrusion. In the protruding portion, the relocation layer and the porous layer on the porous layer are broken, and a separation start portion is formed on the bonded laminated substrate 30. When the processing apparatus 200 is used in the separation step (main separation step) shown in Fig. 1E, the bonded laminated substrate 30 having the separation start portion is attached to the support portion 203 at the portion on the opposite side of the separation start portion. Is supported by. In this state, the wedge 210 is properly inserted into the separation start portion. Next, the wedge 210 is pushed in and continued to separate. FIG. 8 shows the formation of the separation start portion on the bonded substrate stack 30 shown in FIG. However, similarly to the bonded laminated substrate 30 shown in FIG. 5 or other bonded laminated substrates having protrusions, the separation start portion may be formed by the processing apparatus 200. When the processing apparatus 200 is used continuously in the separation start portion forming step (preliminary separation step) and the separation step (main separation step), after the separation start portion is formed, the wedge 210 is pressed to form a bonded laminate substrate ( 30) Bring in further. [Third Processing Device] 9 is a diagram schematically showing the configuration of a processing apparatus according to another preferred embodiment of the present invention. The processing apparatus 300 shown in FIG. 9 has a processing tank 301 and a vibration source 302 for supplying vibration energy such as ultrasonic waves to the processing tank 301. In the treatment apparatus 300, the treatment tank 301 is filled with a vibration energy transfer medium such as water or etching liquid. One or a plurality of bonded laminated substrates 30 accommodated in the carrier 310 are placed in the processing tank 301, and in this state, the bonded laminated substrates 30 are processed. When the processing apparatus 300 is used for the separation start forming step (preliminary separation step) shown in FIG. 1D, as shown in FIG. 9, one or more bonded laminated substrates are projected downward. In the carrier 310 to face. Next, the carrier 310 is placed in the treatment tank 301. The treatment tank 301 is filled with a vibration transmission medium such as water or an etching solution so that the protrusions of the bonded substrate stack 30 to each other are immersed in the transmission medium, and the vibration source 302 is operated. The vibration energy effectively acts on the porous layer below the separating layer at the protrusion to destroy the porous layer. Therefore, the moving layer on the porous layer is peeled off, and a separation start portion is formed on each bonded substrate stack. The SOI substrate manufacturing method has been described above. As the semiconductor layer 13 transferred from the first substrate to the second substrate, other Si layers such as a polycrystalline Si layer and an amorphous Si layer may be formed instead of the single crystal Si layer. Alternatively, Ge layers, SiGe layers, SiC layers, C layers, or compound semiconductor (eg, GaAs, InP, and GaN) layers may be formed. That is, the SOI substrate manufacturing method and the first substrate regeneration method can also be applied to the semiconductor substrate manufacturing method and the first substrate regeneration method other than the SOI substrate. As the second substrate, besides a single crystal Si substrate, a substrate in which an oxide film is formed on the substrate surface, an insulating layer substrate (for example, a quartz substrate) and a light transmissive substrate (for example, a quartz substrate) are preferably used. The first substrate 10 and the second substrate 20 may be bonded with an adhesive. The method can be applied to the manufacture of a composite member formed in close contact with a second member having a separation layer therein or to the separation of the composite member. In this case, the first member corresponds to the first substrate 10, the second member corresponds to the second substrate 20, the separation layer corresponds to the porous layer, and the composite member corresponds to the bonded laminated substrate 30. Corresponds to. EXAMPLE Specific examples of the above embodiments are described below. Example 1 First, in order to form the first substrate, for example, a P-type or n-type single crystal Si substrate 11 having a specific resistance of 0.01 Ωcm is prepared. The single crystal Si substrate 11 is subjected to two-step anodization treatment in HF solution to form a porous Si layer 12 having two layers of porous layers having different porosities on the surface of the single crystal Si substrate. 1A, at this time, the polarization conditions are as follows. <Anodic oxidation condition of the first step> Current density: 7 (mA / ㎠) Anodic solution: HF: H 2 O: C 2 H 5 OH = 1: 1: 1 Processing time: 5 (min) Porous Si Thickness: 4.5 (㎛) <Anodic oxidation condition of the second step> Current density: 30 (mA / ㎠) Anodic solution: HF: H 2 O: C 2 H 5 OH = 1: 1: 1 Processing time: 10 (min) Porous Si Thickness: 0.2 (㎛) In Example 1, the porous layer 12 has a two-layer structure. The porous layer on the surface side formed in the first step using low current is used to form the high quality epitaxial Si layer 13. The lower porous layer formed in the second step using the high current was used as the separation layer. The thickness of the porous layer formed in the first anodization treatment is not limited to the above examples, and for example, several hundreds of m to 0.1 m is preferable. The thickness of the porous layer formed in the second anodization treatment is also not limited to the above examples, and may be appropriately changed according to the conditions of the following separation treatment step. Porous layer 12 has one or three or more layers. Next, the substrate was oxidized in an oxygen atmosphere at 400 ° C. for 1 hour. By the oxidation treatment, the inner wall of the hole in the porous layer 12 is covered with a thermal oxide film. A 0.3 micrometer-thick single crystal Si layer 13 is epitaxially grown on the porous Si layer 12 by CVD (chemical vapor deposition) (FIG. 1B). In the initial stage of epitaxial growth, the surface of the porous Si layer 12 is exposed to H 2 . Thus, the hole on the surface is filled to form a flat surface. <Epitaxial Growth Conditions> Source gas: SiH 2 cl 2 / H 2 Gas flow rate: 0.5 / 180 (1 / min) Gas pressure: 80 (Torr) Temperature: 950 (℃) Growth rate: 0.3 (㎛ / min) On the surface of the epitaxially grown single crystal Si layer 13, a 200 nm thick silicon oxide layer 14 is formed by thermal oxidation (Fig. 1B). The first substrate 10 is obtained by the above process. An Si substrate (second substrate) having the same size as that of the first substrate was prepared. The surface of the SiO 2 layer of the first substrate 10 and the center position of the second substrate 20 are shifted in close contact with each other. The resulting structure is annealed at 1,180 ° C. for 5 minutes to form a bonded laminate substrate 30, as shown in FIG. 2, with protrusions (FIG. 1C). In Example 1, both substrates are bonded by shifting the center of the first substrate 10 by 0.1 nm from the center of the second substrate. As shown in FIG. 3, the bonded laminated substrate 30 is installed in the processing apparatus 100 while the protrusion of the bonded laminated substrate 30 faces the spray nozzle 105. A fluid (reduced in this case) is injected into the protrusion for several seconds from the injection nozzle 105 having a diameter of 0.1 mm at a pressure of 500 kgf / cm 2 to form a separation start portion 40 on the bonded substrate stack (FIG. 1D). As shown in FIG. 4, while the fluid is injected into the separation start section 40, the pressure of the fluid injected from the injection nozzle 105 is reduced to 400 kgf / cm 2. As shown in FIG. 4, while rotating the bonded substrate stack 30, the bonded substrate stack 30 is completely separated from the porous layer (FIG. 1E). After separation, the porous layer 12b, which remains on the surface of the second substrate 20 ', is selectively etched using a mixed solution of 49% hydrofluoric acid, 30% hydrogen peroxide and water as the silver etching solution (FIG. 1F). The above process yields an SOI substrate as shown in Fig. 1F. The porous layer 12b remaining on the surface of the single crystal Si substrate 11 is selectively etched using a mixed solution of 49% hydrofluoric acid, 30% hydrogen peroxide and water as an etching solution (Fig. 1G). Instead of the single crystal Si layer 13, for example, another Si layer such as a polycrystalline layer or an amorphous Si layer may be formed, or a Ge layer, a SiGe layer, a SiC layer, a C layer, and a compound semiconductor (for example, GaAs , InP, and GaN) layers may be formed. As the second substrate 20, an Si substrate having an oxide film formed on the surface, an insulating substrate (for example, a quartz substrate), or a light transmissive substrate (for example, a quartz substrate) may be used instead of the single crystal Si substrate. . Example 2 First, in order to form the first substrate 10, for example, a P-type or n-type single crystal Si substrate 11 having a specific resistance of 0.01 Ωcm is prepared. The single crystal Si substrate 11 is subjected to two-step anodization treatment in an HF solution to form a porous Si layer having two layers of porous layers having different versatility on the surface of the single crystal Si substrate (FIG. 1A). The polarization conditions are as follows. <Polarization Condition of First Step> Current density: 7 (mA / ㎠) Anodic solution: HF: H 2 O: C 2 H 5 OH = 1: 1: 1 Processing time: 5 (min) Porous Si Thickness: 4.5 (㎛) <Polarization Condition of Second Step> Current density: 30 (mA / ㎠) Anodic solution: HF: H 2 O: C 2 H 5 OH = 1: 1: 1 Processing time: 10 (min) Porous Si Thickness: 0.2 (㎛) In Example 2, the porous layer 12 has a two-layer structure. The surface-side porous layer formed in the first step using low current is used to form the high quality epitaxial Si layer 13. The thickness of the porous layer formed in the first anodizing step is not limited to the above example, and for example, several hundreds of micrometers to 0.1 micrometer is preferable. The thickness of the porous layer formed in the second anodization treatment step is not limited to the above example, and may be appropriately changed according to the state of the next separation treatment step. Porous layer 12 may have one or three or more layers. Next, the substrate is oxidized in an air atmosphere at 400 ° C. for 1 hour. By the oxidation treatment, the inner wall of the hole in the porous layer 12 is covered with a thermal oxide film. A 0.3 탆 thick single crystal Si layer 13 is epitaxially grown on the porous Si layer 12 by CVD (chemical vapor deposition) (FIG. 1B). Growth conditions are as follows. In the initial state of epitaxial growth, the surface of the porous Si layer 12 is exposed to H 2 . Thus, the hole on the surface is filled to form a flat surface. <Epitaxial Growth Conditions> Source gas: SiH 2 cl 2 / H 2 Gas flow rate: 0.5 / 180 (1 / min) Gas pressure: 80 (Torr) Temperature: 950 (℃) Growth rate: 0.3 (㎛ / min) On the surface of the epitaxially grown single crystal Si layer, a 200 nm thick SiO 2 layer 14 is formed by thermal oxidation (FIG. 1B). By the above process, the first substrate 10 is obtained. An Si substrate (second substrate) having the same size as that of the first substrate 10 is produced. The surface of the SiO 2 layer of the first substrate 10 and the center position of the second substrate 20 are shifted in close contact with each other. The resulting structure is annealed at 1,180 ° C. for 5 minutes to form a bonded laminate substrate 30, as shown in FIG. 2 with protrusions (FIG. 1C). In Example 2, both substrates are joined by shifting the center of the first substrate 10 by 0.1 nm from the center of the second substrate 20. As shown in FIG. 8, the portion on the opposite side of the protrusion of the bonded substrate stack 30 is supported by the support 203 of the processing apparatus 200. In this state, the wedge 210 is inserted about 1.5 mm into the gap of the protrusion of the bonded laminated substrate 30 parallel to the bonded boundary surface of the bonded laminated substrate 30 (FIG. 1D). As the wedge 210, a PTFE wedge having a tip angle of 20 ° is used. By carrying out the above treatment, a bonded laminated substrate 30 having a separation start portion can be obtained. As shown in FIG. 4, the bonded laminated substrate 30 is installed in the processing apparatus 100 so that the separation start portion 40 of the bonded laminated substrate 30 faces the spray nozzle 105. Separation is started by injecting a fluid into the separation start unit 40 at a pressure of 400 kgf / cm 2 from the injection nozzle 105 having a diameter of 0.1 mm. Next, when the bonded laminated substrate 30 is rotated, separation advances, and the bonded laminated substrate 30 is separated into two substrates in the porous layer 12a (FIG. 1E). The porous layer 12b remaining on the surface of the second substrate 20 'after separation is selectively etched using a mixed solution of 49% hydrofluoric acid, 30% hydrogen peroxide and water as an etching solution (FIG. 1F). By executing the above process, an SOI substrate as shown in Fig. 1F is obtained. The porous layer 12b remaining on the surface of the single crystal Si substrate 11 is selectively etched using a mixed solution of 49% hydrofluoric acid, 30% hydrogen peroxide and water as an etching solution (Fig. 1G). Instead of the single crystal Si layer, for example, other Si layers such as polysilicon layers or amorphous Si layers may be formed, and Ge layers, SiGe layers, SiC layers, C layers, and compound semiconductors (GaAs, InP, and GaN). ) May be formed. As the second substrate 20, an Si substrate having an oxide film formed on its surface and an insulating substrate (for example, a quartz substrate) or a light transmissive substrate (for example, a quartz substrate) may be used instead of the single crystal Si substrate. Third Embodiment First, in order to form the first substrate 10, for example, a P-type or n-type single crystal Si substrate 11 having a specific resistance of 0.01 Ωcm is prepared. The single crystal silicon substrate is subjected to two-step anodization in an HF solution to form a porous Si substrate 12 including two layers of porous layers having different porosities on the surface of the single crystal Si substrate (FIG. 1A). Anodization treatment conditions are as follows. <Polarization Condition of First Step> Current density: 7 (mA / ㎠) Anodic solution: HF: H 2 O: C 2 H 5 OH = 1: 1: 1 Processing time: 5 (min) Porous Si Thickness: 4.5 (㎛) <2nd step polarization condition> Current density: 30 (mA / ㎠) Anodic solution: HF: H 2 O: C 2 H 5 OH = 1: 1: 1 Processing time: 10 (min) Porous Si Thickness: 0.2 (㎛) In Example 3, the porous layer 12 has a two-layer structure. The surface-side porous layer formed in the first step using low current is used to form the high quality epitaxial Si layer 13. The lower porous layer formed in the second step using the high current is used as the separation layer. The thickness of the porous layer formed in the first anodization step is not limited to the above examples, and for example, several hundred micrometers to 0.1 micrometer is preferable. The thickness of the porous layer formed in the second anodization step is not limited to the above example, and may be appropriately changed according to the conditions of the following separation step. Porous layer 12 has one or three or more layers. Next, the substrate is subjected to oxidation treatment at 400 ° C. for about 1 hour in an oxygen atmosphere. By performing the oxidation treatment, the inner wall of the hole in the porous layer 12 is covered with a thermal oxide film. A 0.3 micrometer thick single crystal Si layer 13 is epitaxially grown on the porous Si layer 12 by CVD (chemical vapor deposition) (FIG. 1B). Growth conditions are as follows. In the initial stage of epitaxial growth, the surface of the porous Si layer 12 is exposed to H 2 , whereby holes in the surface are filled to form a flat surface. <Epitaxial Growth Conditions> Source gas: SiH 2 cl 2 / H 2 Gas flow rate: 0.5 / 180 (1 / min) Gas pressure: 80 (Torr) Temperature: 950 (℃) Growth rate: 0.30 (㎛ / min) On the surface of the epitaxially grown single crystal Si layer 13, a 200 nm thick SiO layer 14 is formed by thermal oxidation. The first substrate 10 is obtained by the above process. An Si substrate (second substrate) 20 having the same size as that of the first substrate 10 is manufactured. The surface of the SiO 2 layer 14 of the first substrate and the center position of the second substrate 20 are shifted in close contact with each other. The synthetic substrate is annealed at 1,180 ° C. for 5 minutes to form a bonded laminated substrate 30 having protrusions, as shown in FIG. 2 (FIG. 1C). In Example (3), the two substrates are bonded while shifting the center of the first substrate 10 and the center of the second substrate 20 by 0.1 mm. As shown in FIG. 9, the plurality of bonded substrate stacks 30 are accommodated in the carrier 310 with its protrusions facing down. Thereafter, the carrier 310 is placed in the treatment tank 301. The carrier 310 is filled with pure water so that the protrusions of the bonded substrate stack 30 are immersed. The vibration source is operated for about 1 hour to form a separation start portion in each bonded substrate stack 30 (FIG. 1E). Instead of pure water, an etchant can also be preferably used. In this case, the vibration source 302 preferably operates to supply vibration energy to the protrusions. Even when vibration energy is not supplied to the protruding portion, the separation start portion can be formed by the etching action of the etching liquid. An example of the use of etching liquid is demonstrated. The protrusions of the bonded substrate substrate were immersed in hydrofluoric acid to remove the insulating layer (SiO 2 layer) from the protrusions, and then the protrusions were immersed in fluoronitric acid to remove the single crystal Si layer 13 from the protrusions, and finally, at the protrusions. It is preferable to remove the porous layer 12. As shown in FIG. 4, the bonded substrate stack 30 is installed in the processing apparatus 100 while the separation start portion 40 of the bonded substrate stack 30 faces the spray nozzle 40. Separation is started by injecting a fluid of 400 kgf / cm 2 pressure into the separation start section 40 from the injection nozzle having a diameter of 0.1 nm. Subsequently, when separation is performed while rotating the bonded substrate stack 30, the bonded substrate stack 30 is separated into two substrates in the porous layer 12a (FIG. 1E). The porous layer 12b remaining on the surface of the second substrate 20 'after separation is selectively etched using a mixed solution composed of 49% hydrofluoric acid, 30% hydrogen peroxide and water as an etching solution (FIG. 1F). By carrying out this process, an SOI substrate as shown in Fig. 1F can be obtained. The porous layer 12b remaining on the surface of the single crystal Si substrate can be selectively etched using a mixed solution composed of 49% hydrofluoric acid, 30% hydrogen peroxide and water as an etching solution (Fig. 1G). Instead of the single crystal Si layer 13, for example, another Si layer such as a polycrystalline Si layer or an amorphous Si layer may be formed, or a Ge layer, a SiGe layer, a SiC layer, a C layer, and a compound semiconductor (for example, For example, GaAs, InP, or GaN) may be formed. As the second substrate 20, instead of a single crystal Si substrate, an Si substrate having an oxide film formed on its surface, an insulating substrate (for example, a quartz substrate, or a light transmissive substrate (for example, a quartz substrate) may be used. Example 4 First, in order to form the first substrate 10, for example, a P-type or n-type single crystal Si substrate 11 having a specific resistance of 0.01 Ωcm is manufactured. The single crystal Si substrate 11 is subjected to two-step anodization treatment in an HF solution to form a porous Si substrate 12 including two layers of porous layers having different porosities on the surface of the single crystal Si substrate (FIG. 1A). . The polarization conditions are as follows. <First polarization condition> Current density: 7 (mA / ㎠) Anodic solution: HF: H 2 O: C 2 H 5 OH = 1: 1: 1 Processing time: 5 (min) Porous Si Thickness: 4.5 (㎛) <Second polarization condition> Current density: 30 (mA / ㎠) Anodic solution: HF: H 2 O: C 2 H 5 OH = 1: 1: 1 Processing time: 10 (min) Porous Si Thickness: 0.2 (㎛) In Example (4), the porous layer 12 has a two-layer structure. The surface layer porous layer formed in the first step using low current is used to form a high quality epitaxial Si layer 13. The lower porous layer formed in the second step using the high current is used as the separation layer. The thickness of the porous layer formed in the first anodizing step is not limited to the above examples, and for example, several hundred micrometers to 0.1 micrometer is preferable. In addition, the thickness of the porous layer formed in the second anodizing step may be appropriately changed in accordance with the state of the subsequent separation treatment process. The porous layer 12 may have a structure of one layer or three or more layers. Next, oxidation treatment is performed for about 1 hour at a temperature of 400 캜 in the substrate oxygen atmosphere. By carrying out the oxidation treatment, the inner wall of the hole in the porous layer 12 is covered with a thermal oxide film. On the porous Si, a single crystal Si layer 13 having a thickness of 0.3 mu m is grown in a lamination by CVD (chemical vapor deposition) (FIG. 1B). Growth conditions are as follows. In the initial state of epitaxial growth, by exposing the surface of the porous Si layer to H 2 , holes in the surface are filled to form a flat surface. <Epitaxial Growth Conditions> Source gas: SiH 2 cl 2 / H 2 Gas flow rate: 0.5 / 180 (1 / min) Gas pressure: 80 (Torr) Temperature: 950 (℃) Growth rate: 0.30 (㎛ / min) A 200 nm thick SiO 2 layer is formed on the surface of the epitaxially grown single crystal Si layer 13 by thermal oxidation. The first substrate 10 is obtained by the above process. An Si substrate (second substrate) 20 having a diameter 0.5 mm smaller than the diameter of the first substrate is produced. The surface of the SiO 2 layer of the first substrate and the second substrate 20 are brought into close contact with each other while the center of the first substrate coincides with the center of the second substrate. The composite structure was heat treated at 1,180 DEG C for 5 minutes to form a bonded laminated substrate having protrusions, as shown in Fig. 2 (Fig. 1C). The first substrate 10 and the second substrate having the same size are brought into close contact with each other, and heat-treated to form a bonded laminate substrate, and then edge grinding or the like to form the second substrate 20 of the bonded substrate stack. The protrusion may be formed by polishing the outer peripheral portion. As shown in FIG. 6, the bonded laminated substrate 30 is installed in the processing apparatus 100 while the protrusion of the bonded laminated substrate 30 faces the spray nozzle 105. From the injection nozzle 105 having a diameter of 0.1 mm, a fluid of 400 kgf / cm < 2 > pressure (reduced in this embodiment) is sprayed on the protrusion to form a separation start portion 40 on the bonded laminated substrate 30 (Fig. 1D). ). As shown in Fig. 7, the fluid is ejected from the injection nozzle 105, and the rotation of the bonded substrate stack is started. Then, when the bonded substrate stack 30 is rotated, the bonded substrate stack is completely separated from the porous layer 12 (Fig. 1E). After separation, the porous layer 12b remaining on the surface of the second substrate 20 'can be selectively etched using a mixed solution of 49% hydrofluoric acid, 30% hydrogen peroxide and water as an etching solution (FIG. 1F). By performing the above process, an SOI substrate as shown in Fig. 1F is obtained. The porous layer 12b remaining on the surface of the single crystal Si substrate can be selectively etched using a mixed solution of 49% hydrofluoric acid, 30% hydrogen peroxide and water as an etching solution (Fig. 1G). Instead of the single crystal Si layer 13, for example, another Si layer such as a polycrystalline silicon layer or an amorphous Si layer may be formed, or a Ge layer, a SiGe layer, a SiC layer, a C layer, and a compound semiconductor (eg For example, GaAs, InP, or GaN) may be formed. As the second substrate, instead of the single crystal Si substrate, an Si substrate having an oxide film formed on the surface, an insulating substrate (for example, a quartz substrate, or a light transmissive substrate (for example, a quartz substrate) may be used. Example 5 In Example (5), a porous layer (microcavity layer) is formed by ion implantation. First, a SiO 2 layer having a thickness of 200 μm is formed on the surface of a single crystal Si substrate by thermal oxidation. Ions are implanted through the SiO 2 layer of the single crystal Si substrate so that the projection range corresponds to the predetermined length of the single crystal Si substrate. By the ion implantation process, a porous layer (ion implantation layer or microcavity layer) 12 and a single crystal Si layer are formed on the same substrate as the first substrate 10 shown in FIG. 1B, that is, the single crystal Si substrate 11. A substrate having 13 and an insulating layer is formed. The surface of the SiO 2 layer of the first substrate is brought into close contact with the surface of the 8 inch Si substrate (second substrate) 20 separately prepared. Heat treatment is performed at 600 ° C. for 10 hours to increase the bond strength. A bonded laminate substrate as shown in FIG. 1C can be obtained. In Example 5, the two substrates are joined while shifting the center of the first substrate and the center of the second substrate by about 0.1 mm. As shown in FIG. 3, the bonded laminated substrate 30 is installed in the processing apparatus 100 while the protrusion of the bonded laminated substrate 30 faces the spray nozzle 105. A jet of fluid (in this case, water is used) is injected into the protrusion for a few seconds from the injection nozzle 105 having a diameter of 0.1 mm at a pressure of 500 kgf / cm 2 to form a separation start portion 40 on the bonded laminated substrate (Fig. 1D). As shown in FIG. 4, while injecting the fluid into the separation start unit 40, the pressure of the fluid injected from the injection nozzle 105 is reduced to 400 kgf / cm 2. As shown in FIG. 4, the bonded laminate substrate is completely separated from the porous layer 12 while rotating the bonded laminate substrate 30 (FIG. 1E). After separation, the porous layer 12b remaining on the surface of the second substrate 20 'is selectively etched using a mixed solution of 49% hydrofluoric acid, 30% hydrogen peroxide and water as an etching solution (FIG. 1F). By performing the above process, an SOI substrate as shown in Fig. 1F is obtained. The porous layer 12b remaining on the surface of the single crystal Si substrate can be selectively etched using a mixed solution of 49% hydrofluoric acid, 30% hydrogen peroxide and water as an etching solution (Fig. 1G). Instead of the single crystal Si layer 13, for example, another Si layer such as a polycrystalline silicon layer or an amorphous Si layer may be formed, or a Ge layer, a SiGe layer, a SiC layer, a C layer, and a compound semiconductor (eg For example, GaAs, InP, or GaN) may be formed. As the second substrate, instead of the single crystal Si substrate, an Si substrate having an oxide film formed on the surface, an insulating substrate (for example, a quartz substrate) or a light transmissive substrate (for example, a quartz substrate) may be used. According to the present invention, a composite member such as a bonded laminated substrate can be appropriately separated at a separation start portion such as a porous layer. The present invention is not limited to the above embodiments, and various changes and modifications can be made within the spirit and scope of the present invention. Therefore, to apprise the scope of the present invention, the following claims are made. In the present invention, a composite member such as a bonded laminated substrate can be appropriately separated at a separation start portion such as a porous layer.
权利要求:
Claims (59) [1" claim-type="Currently amended] In the separation method of the composite member having a structure in which the first member having a separation layer therein in close contact with the second member, The composite member has a protrusion in which an outer peripheral portion of the first member protrudes outward of the outer peripheral portion of the second member, The separating method of the composite member, characterized in that it comprises a separation step of separating the composite member into two members in the separation layer after starting the separation of the composite member from the protrusion. [2" claim-type="Currently amended] The method of claim 1 The main surface of the first member has the same shape as the main surface of the second member, and the composite member has a structure in which the main surface of the first member and the main surface of the second member are in close contact with each other while shifting the center position of each other Separation method of a composite member [3" claim-type="Currently amended] The method of claim 1 The main surface of the second member is smaller than the main surface of the first member, the composite member has a structure in which the main surface of the first member and the main surface of the second member is in close contact with each other. [4" claim-type="Currently amended] The method according to any one of claims 1 to 3, The separating step includes a preliminary separation step of processing the protrusion to form a separation start portion, starting one separation of the composite member from the separation start portion, and then substantially destroying only the separation layer to separate the composite member from the separation layer. Separation method of a composite member characterized in that the main split step for separating into two members [5" claim-type="Currently amended] The first member including a separation layer therein in close contact with the second member to produce a composite member having a protrusion having an outer circumference of the first member protruding to the outside of the outer circumference of the second member. Manufacturing method. [6" claim-type="Currently amended] In the relocation method of the relocation layer for relocating the transfer layer to the second member on the surface of the first member, A composite member including a separation layer therein and a first member including the separating layer on the separation layer is in close contact with a second member to produce a composite member in which an outer circumference of the first member protrudes outward of an outer circumference of the second member. A preliminary step; Separation step of moving the separation layer of the first member to the second member by starting the separation of the composite member from the protrusion and separating the composite member into two members in the separation layer. Relocation method of floor [7" claim-type="Currently amended] In the separation method of the composite member for separating the bonded laminated substrate having a structure formed by closely contacting the first substrate having the separation layer and the moving layer on the separation layer to the second substrate therein into two substrates, The bonded laminated substrate has a protrusion in which an outer circumferential portion of the first substrate protrudes outward of an outer circumferential portion of the second substrate; The method of separating the composite member comprises: a separating step of separating the bonded laminated substrate from the protruding portion and separating the bonded laminated substrate into two substrates from the bonded layer. [8" claim-type="Currently amended] The method of claim 7, wherein The first substrate has the same size as that of the second substrate, and the bonded substrate has a structure in which the substrates are in close contact with each other while the center positions of the first substrate and the second substrate are shifted from each other. How to separate [9" claim-type="Currently amended] The method of claim 7, wherein The bonded laminated substrate has a structure in which the first substrate has a structure in close contact with the second substrate smaller than the first substrate. [10" claim-type="Currently amended] The method of claim 7, wherein The second substrate has either an orientation flat or a notch, and the bonded laminated substrate has a portion where the first substrate is exposed in the presence of an orientation flat or notch of the second substrate as the protrusion. Separation method of a composite member, characterized in that having [11" claim-type="Currently amended] The method of claim 7, The first substrate and the second substrate each have one of an orientation flat and a notch, and the bonded laminate substrate matches an orientation flat or notch of the first substrate with an orientation flat or notch of the second substrate. Separation method of the composite member, characterized in that formed by the first substrate and the second substrate is in close contact with each other without [12" claim-type="Currently amended] Joining the separating layer of the first substrate having a separating layer therein and including the separating layer on the separating layer to the second substrate, the protrusion portion of the outer peripheral portion of the first substrate protrudes outward of the outer peripheral portion of the second substrate A method for producing a bonded laminate substrate, the method comprising: manufacturing a bonded laminate substrate having: [13" claim-type="Currently amended] In the relocation method of the relocation layer which relocates the relocation layer on the surface of a 1st board to a 2nd board | substrate, Bonding the separating layer of the first substrate having a separating layer therein and a separating layer on the separating layer to the second substrate so that the outer peripheral portion of the first substrate protrudes outward of the outer peripheral portion of the second substrate. A preliminary step of manufacturing a laminated substrate; And a separation step of releasing the bonded layer substrate from the first substrate to the second substrate by initiating separation of the bonded laminate substrate from the protrusion and separating the bonded laminate substrate from the separation layer. How to move the floor. [14" claim-type="Currently amended] The method of claim 13, The preliminary step includes a step of bringing the substrates into close contact with each other while moving the center positions of the first and second substrates having the same size to manufacture the bonded substrate stack. [15" claim-type="Currently amended] The method of claim 13, The preliminary step may include the step of bringing the first substrate into close contact with the second substrate smaller than the first substrate to manufacture the bonded substrate stack. [16" claim-type="Currently amended] The method of claim 13, The preliminary step may include: the second substrate having either an orientation flat and a notch for manufacturing the bonded laminate substrate having, as a protrusion, a portion where the first substrate is exposed in the presence of an orientation flat or notch of the second substrate. A method of moving a moving layer, comprising the step of bringing the first substrate into close contact with the substrate. [17" claim-type="Currently amended] The method of claim 13, The preliminary step includes the steps of preparing the first substrate and the second substrate each having an orientation flat and a notch; In order to manufacture the bonded substrate stack, the step of bringing the first substrate and the second substrate into close contact with each other without matching the orientation flat or notch of the first substrate to the orientation flat or notch of the second substrate. Relocation method of the feature layer [18" claim-type="Currently amended] The method of claim 13, The separation step may include a preliminary separation step of processing the protrusion to form a protrusion start portion; Initiating separation of the bonded laminated substrate from the separation start portion, and substantially breaking only the separated layer to separate the bonded laminated substrate into two substrates in the separated laminated substrate. [19" claim-type="Currently amended] The method of claim 18, The preliminary separation step includes a step of injecting a fluid into the protrusion to form the initiation portion by the fluid. [20" claim-type="Currently amended] The method of claim 18, The preliminary separation step includes a step of inserting a wedge-shaped member into the gap between the first substrate and the second substrate at the protrusion to form the separation start portion. [21" claim-type="Currently amended] The method of claim 18, The preliminary separation step includes a step of applying vibration energy to the projecting portion to form the separation start portion. [22" claim-type="Currently amended] The method of claim 18, The preliminary separation step may include a step of immersing the protrusion in the fluid to form the separation start portion and supplying energy to the protrusion through the fluid. [23" claim-type="Currently amended] The method of claim 22, A method for moving a moving layer, characterized in that water is used as the fluid. [24" claim-type="Currently amended] The method of claim 22, Relocation method of the relocation layer characterized by using an etching solution as a fluid [25" claim-type="Currently amended] The method of claim 18, The preliminary separation step, comprising the step of etching the separation layer and the separation layer in the protrusion to form the separation start portion. [26" claim-type="Currently amended] The method according to any one of claims 13 to 17, The separating step includes the step of injecting a fluid into the protrusion to form the separation start portion on the bonded laminated substrate, and the step of continuously separating the bonded laminated substrate while changing the position where the fluid is injected. Relocation method [27" claim-type="Currently amended] The method according to any one of claims 13 to 17, The separating step includes a step of inserting a wedge-shaped member into the gap between the first substrate and the second substrate in the projection to separate the bonded laminated substrate. [28" claim-type="Currently amended] The method according to any one of claims 18 to 25, The separation start unit, the separation method of the separation layer, characterized in that the part having the most fragile structure in the portion. [29" claim-type="Currently amended] The method according to any one of claims 18 to 25, The separation initiation method of the separation layer, characterized in that for removing the separation layer in the portion of the separation layer below the separation layer is exposed. [30" claim-type="Currently amended] The method according to any one of claims 18 to 25, The separation starting portion, the separation layer is exposed in the portion, the separation method of the separation layer, characterized in that the outer peripheral portion of the separation layer is located inside the bonded substrate. [31" claim-type="Currently amended] The method according to any one of claims 13 to 30, Relocation method of the separation layer, characterized in that the separation layer is a porous layer [32" claim-type="Currently amended] The method according to any one of claims 13 to 30. The first substrate is formed by anodicizing a substrate to form a porous layer as the separation layer and forming the transfer layer on the separation layer. [33" claim-type="Currently amended] The method according to any one of claims 13 to 30, The first substrate has a porous layer formed by ion implantation, the separation layer, characterized in that the separation layer. [34" claim-type="Currently amended] The method according to any one of claims 13 to 33, The relocation layer is a relocation layer, characterized in that it comprises a single crystal Si layer. [35" claim-type="Currently amended] The method according to any one of claims 13 to 33, The relocation layer has a single crystal Si layer and an insulating layer sequentially as the relocation layer. [36" claim-type="Currently amended] A protrusion in which the outer periphery of the first substrate protrudes to the outer surface of the outer periphery of the second substrate by closely contacting the surface of the first substrate having a porous layer therein and a separating layer having a monocrystalline Si layer on the porous layer to the second substrate. A preliminary step of manufacturing a bonded laminated substrate having a; A separation step of relocating the transfer layer of the first substrate to the second substrate by initiating separation of the bonded laminate substrate from the protrusions and separating the bonded laminate substrate from the porous layer; And a removing step of removing the porous layer remaining on the surface of the second substrate after separation. [37" claim-type="Currently amended] The method of claim 36, The first substrate has an insulating layer on the single crystal Si layer and the single crystal Si layer as the transfer layer. [38" claim-type="Currently amended] The method of claim 36, The second substrate has a method of manufacturing an SOI substrate, characterized in that having an insulating layer on the surface [39" claim-type="Currently amended] The method according to any one of claims 36 to 38, The preliminary step includes manufacturing a SOI substrate, wherein the preliminary step includes a step of closely contacting the substrates while moving the center positions of the first substrate and the second substrate having the same size in order to manufacture the bonded substrate stack. Way [40" claim-type="Currently amended] The method according to any one of claims 36 to 38, The preliminary step includes a step of bringing the first substrate into close contact with the second substrate smaller than the first substrate to manufacture the bonded laminate substrate. [41" claim-type="Currently amended] The method of claim 40, The preliminary step includes a step of bringing these substrates into close contact with each other while the center positions of the first substrate and the second substrate coincide with each other. [42" claim-type="Currently amended] The method according to any one of claims 36 to 38, The preliminary step includes the first substrate having any one of an orientation flat and a notch, in order to manufacture the bonded laminate substrate having as a protrusion a portion of the first substrate exposed in the presence of an orientation flat and a notch of the second substrate. And a step of bringing the first substrate into close contact with the second substrate. [43" claim-type="Currently amended] The method according to any one of claims 36 to 38, The preliminary step includes the steps of manufacturing the first substrate and the second substrate each having one of an orientation flat and a notch, and an orientation flat or notch of the first substrate and the first substrate to manufacture the bonded substrate stack. And a step of bringing the first substrate and the second substrate into close contact with each other without matching the orientation flats or notches of the two substrates. [44" claim-type="Currently amended] The method of any one of claims 36 to 43, wherein The separation step, A preliminary separation step of processing the protrusion to form a separation start portion; And separating the bonded laminated substrate from the porous layer into two substrates by starting the separation of the bonded laminated substrate from the separation start unit, and then breaking only the porous layer. [45" claim-type="Currently amended] The method of claim 44, The anticipating step includes a step of injecting a fluid into the protruding portion so as to form the separation start portion by the fluid. [46" claim-type="Currently amended] The method of claim 44, The preliminary step includes the step of inserting a wedge-shaped member into the gap between the first substrate and the second substrate at the protrusion to form the separation start portion. [47" claim-type="Currently amended] The method of claim 44, The preliminary step includes a step of supplying vibration energy to the protruding portion to form the separation start portion. [48" claim-type="Currently amended] The method of claim 44, The preliminary step includes a step of immersing the protrusion in the fluid to form the separation start portion and supplying vibration energy to the protrusion through the fluid. [49" claim-type="Currently amended] The method of claim 48, Method for producing SOI substrate, characterized in that water is used as a fluid [50" claim-type="Currently amended] The method of claim 48, SOI substrate manufacturing method characterized by using an etching solution as a fluid [51" claim-type="Currently amended] The method of claim 44, The preliminary step includes a step of etching the transfer layer and the porous layer in the protrusion to form the separation start portion. [52" claim-type="Currently amended] The method of any one of claims 36 to 43, wherein The separating step includes the step of injecting a fluid to the protrusion to form the separation start portion on the bonded laminated substrate, and the step of continuously separating the bonded laminated substrate while changing the position where the fluid is injected. SOI substrate manufacturing method. [53" claim-type="Currently amended] The method of any one of claims 36 to 43, wherein The separating step includes a step of inserting a wedge-shaped member into the gap between the first substrate and the second substrate at the protrusion to separate the bonded laminated substrate. [54" claim-type="Currently amended] The method of any one of claims 36 to 43, wherein The separation initiation part is a method of manufacturing an SOI substrate, characterized in that the porous layer is the portion having the most fragile structure in the portion. [55" claim-type="Currently amended] The method of any one of claims 36 to 43, wherein And the separation start portion is a portion from which the transfer layer is removed from the portion and the porous layer below the tongue layer is exposed. [56" claim-type="Currently amended] The method of any one of claims 36 to 43, wherein The separation start unit is a method of manufacturing an SOI substrate, characterized in that the porous layer is exposed in the portion, the outer peripheral portion of the porous layer is located in the interior of the bonded laminated substrate. [57" claim-type="Currently amended] In the composite member having a structure in which the first member having a separation layer therein is in close contact with the second member, A composite member, characterized in that the outer peripheral portion of the first member includes a protrusion protruding outward of the outer peripheral portion of the second member. [58" claim-type="Currently amended] In a bonded laminated substrate having a structure in which a separation layer inside and a first substrate having a separating layer on the separation layer are in close contact with the second substrate, Bonded laminated substrate, characterized in that the outer peripheral portion of the first substrate has a protrusion projecting to the outside of the outer peripheral portion of the second substrate [59" claim-type="Currently amended] In a bonded substrate stack formed by joining a surface of a first substrate having a porous layer therein and a release layer including a single crystal Si layer on the porous layer to a second substrate, Bonded laminated substrate, characterized in that the outer peripheral portion of the first substrate has a protrusion projecting to the outside of the outer peripheral portion of the second substrate
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同族专利:
公开号 | 公开日 US20020081822A1|2002-06-27| EP1026729A3|2004-04-21| CN1264156A|2000-08-23| JP2000223683A|2000-08-11| US6376332B1|2002-04-23| KR100420311B1|2004-03-02| TW498444B|2002-08-11| EP1026729A2|2000-08-09|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题
法律状态:
1999-02-02|Priority to JP11025484A 1999-02-02|Priority to JP1999-25484 2000-02-02|Application filed by 미다라이 후지오, 캐논 가부시끼가이샤 2000-09-25|Publication of KR20000057896A 2004-03-02|Application granted 2004-03-02|Publication of KR100420311B1
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申请号 | 申请日 | 专利标题 JP11025484A|JP2000223683A|1999-02-02|1999-02-02|Composite member and its isolation method, laminated substrate and its isolation method, relocation method of relocation layer, and method for manufacturing soi substrate| JP1999-25484|1999-02-02| 相关专利
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